Electro optical terahertz pulse reflectometry (EOTPR) is a nondestructive fault isolation technique that is well suited for today’s ICs. This article provides examples of how EOTPR is being used to investigate 2.5D and 3D packages, wafer level fanout packages, and MEMS devices. It also discusses recent advancements in EOTPR systems and software.

3D packages,electro optical terahertz pulse reflectometry,fault isolation,interposers,MEMS devices,wafer level fanout packages
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2018
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Topics
Electronic packaging Semiconductor wafer fabrication Nondestructive testing
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