Magnetic current imaging is a proven fault-isolation technique. Its unsurpassed sensitivity and resolution coupled with the fact that magnetic fields are unaffected by packaging and die materials make it a valuable FA tool for a wide variety of ICs and devices. This article reviews the basic measurement physics of magnetic current imaging, describes the general implementation, and presents several practical examples of its use.

fault isolation,IC defects,magnetic current imaging,noncontact measurement
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Scanning probe microscopy Semiconductor wafer fabrication
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