This is a case study of an illumination-sensitive failure. Due to the unavailability of a scanning optical microscope, fault isolation was performed using a different approach based on available equipment. Through a combination of emission microscopy, FIB isolation, mechanical probing, and in-depth circuit analysis, the root cause and failure mechanism were determined.

emission microscopy,FIB isolation,illumination-sensitive failure,mechanical probing
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Photoemission electron microscopy Semiconductor wafer fabrication Root cause analysis
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