Analog computing is an important step in taking neural net processing to the next level. However, as this column explains, reliability is intimately linked to performance and efficiency in analog systems, more so than in any modern digital system, and further work is required to understand the relationship.

失效分析是研究和表示的observable or measurable phenomena. Risk assessment, on the other hand, is when root causes are studied to predict the potential for future failures. In this article, the author describes a structured problem-solving approach that consists of failure analysis, risk assessment, and advanced modeling. A case study is also presented in which the probability of future failures, due to a delamination defect, is determined based on field returns.

The problem of constructing reliable systems out of unreliable components is usually dealt with through a combination of redundancy and early retirement. This article assesses the potential of an intelligent failure prediction system that depends more on diagnostic data and analytics than built-in redundancy and costly replacement.

This article describes the qualification process for a 1.8 kW laser diode stack designed for the Mars Curiosity rover. The seven-bar stack serves as the optical pump in a boom-mounted spectroscope attached to the front of the rover. Each laser bar is made of 62 single emitters and generates 260 W of instantaneous optical power. A detailed design analysis of the diode stack is presented along with the results of overstress testing and failure analysis.

Faster time-to-production of a new product is the common goal of design houses and foundries. This article demonstrates how foundries can contribute through post silicon validation, which allows design houses to focus on more complicated issues.

This article assesses the progress that has been made in the development and implementation of through-silicon via (TSV) technology, the work yet to be done, and the challenges associated with potential failure mechanisms.

This article describes two accelerated reliability tests that can help shorten product development cycles for power semiconductor packages. One test simulates the effects of temperature cycling by applying a series of thermal shocks to the test sample. The other test assesses the bond between metals and molding compounds as a measure of thermal cycle resistance. A button shear test is used to measure changes in adhesion strength as a function of time and temperature.

Tin whiskers are single-crystal filaments that can grow from tin-plated copper or nickel components. This article discusses the effect of plating thickness, composition, and grain size on tin whisker formation and explains how to assess damage potential based on microanalysis, whisker length distribution models, and metal vapor arc risk factors. The authors also present and analyze several examples of failures caused by tin whisker formation in space systems.

Electronic components and assemblies are subjected to temperature variations at every stage of life, resulting in the buildup of internal stress. This article explains how such stress contributes to failures and introduces a measurement technique that allows users to visualize stress distributions and assess their effects on lifetime and reliability. Application examples illustrating the capabilities of the new topography and deformation measurement approach are also presented.

This article discusses the importance of failure analysis lab safety and presents best practices for setting up and maintaining an effective safety program. It explains how to identify hazards and assess risks associated with X-ray and laser radiation, liquid nitrogen, compressed gases, and soldering processes. It also discusses the use of personal protective equipment, the implementation of practical controls, key performance indicators, and safety standards and regulations.

The reliability of a component is the probability that it will perform its function under specified conditions for a specified length of time. Key considerations in defining and designing reliability tests are reviewed in this article, which also discusses the interpretation of test results.