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1-6 of 6
Reliability analysis
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Journal Articles
EDFA Technical Articles(2021) 23 (4): 57–58.
Published:01 November 2021
Abstract
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Analog computing is an important step in taking neural net processing to the next level. However, as this column explains, reliability is intimately linked to performance and efficiency in analog systems, more so than in any modern digital system, and further work is required to understand the relationship.
Journal Articles
EDFA Technical Articles(2019) 21 (2): 16–20.
Published:01 May 2019
Abstract
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The problem of constructing reliable systems out of unreliable components is usually dealt with through a combination of redundancy and early retirement. This article assesses the potential of an intelligent failure prediction system that depends more on diagnostic data and analytics than built-in redundancy and costly replacement.
Journal Articles
EDFA Technical Articles(2014) 16 (4): 20–24.
Published:01 November 2014
Abstract
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This article assesses the progress that has been made in the development and implementation of through-silicon via (TSV) technology, the work yet to be done, and the challenges associated with potential failure mechanisms.
Journal Articles
EDFA Technical Articles(2013) 15 (4): 22–25.
Published:01 November 2013
Abstract
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This article describes two accelerated reliability tests that can help shorten product development cycles for power semiconductor packages. One test simulates the effects of temperature cycling by applying a series of thermal shocks to the test sample. The other test assesses the bond between metals and molding compounds as a measure of thermal cycle resistance. A button shear test is used to measure changes in adhesion strength as a function of time and temperature.
Journal Articles
EDFA Technical Articles(2011) 13 (3): 4–11.
Published:01 August 2011
Abstract
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Electronic components and assemblies are subjected to temperature variations at every stage of life, resulting in the buildup of internal stress. This article explains how such stress contributes to failures and introduces a measurement technique that allows users to visualize stress distributions and assess their effects on lifetime and reliability. Application examples illustrating the capabilities of the new topography and deformation measurement approach are also presented.
Journal Articles
EDFA Technical Articles(2008) 10 (1): 18–22.
Published:01 February 2008
Abstract
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The reliability of a component is the probability that it will perform its function under specified conditions for a specified length of time. Key considerations in defining and designing reliability tests are reviewed in this article, which also discusses the interpretation of test results.