Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
NARROW
Format
Topics
Journal
Article Type
日期
Availability
1-2 of 2
Qualification
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
EDFA Technical Articles(2019) 21 (2): 22–27.
Published:01 May 2019
Abstract
View article
PDF
This article describes the qualification process for a 1.8 kW laser diode stack designed for the Mars Curiosity rover. The seven-bar stack serves as the optical pump in a boom-mounted spectroscope attached to the front of the rover. Each laser bar is made of 62 single emitters and generates 260 W of instantaneous optical power. A detailed design analysis of the diode stack is presented along with the results of overstress testing and failure analysis.
Journal Articles
EDFA Technical Articles(2005) 7 (1): 10–14.
Published:01 February 2005
Abstract
View article
PDF
Although plastic-encapsulated packaging dominates most of the IC industry, deprocessing and reliability testing continue to be a problem, particularly in industries making the switch from hermetically sealed ceramic packages. This article discusses the challenges designers and failure analysts face in the military and aerospace electronics industry stemming from the use of plastic packages. It provides examples of the types of failures encountered and describes the procedures used to detect and identify them.