The reflected light microscope is the most commonly used tool to study the microstructure of metals, composites, ceramics, minerals, and polymers. For the study of the microstructure of metals and alloys, light microscopy is employed in the reflected-light mode using either bright-field illumination, dark-field illumination, polarized light illumination, or differential interference contract, generally by the Nomarski technique. This article concentrates on how to reveal microstructure properly to enable the proper identification of the phases and constituents and, if needed, measuring the amount, size, and spacing of constituents, using the light optical microscope. The discussion covers the examination of microstructures using different illumination methods and includes a comparison between light optical images and scanning electron microscopy images of microstructure.

Particle image analysis of metal powders can be easily performed with optical macroscopes and microscopes. This article provides examples of the particle image analysis on powders used in the powder metallurgy industry.

本文讨论了photomac的准备rographs of fracture surfaces. It provides useful information on the equipment used, such as view cameras, 35-mm single-lens-reflex cameras, and stereomicroscopes. The article describes the role of lenses, focusing, camera magnification, and selection of lens aperture in a microscopic system. It illustrates the lighting techniques employed in photography and highlights the use of different films. The article concludes with a list of auxiliary equipment used in fracture surface photography.

Scanning electron microscopy (SEM) has shown various significant improvements since it first became available in 1965. These improvements include enhanced resolution, dependability, ease of operation, and reduction in size and cost. This article provides a detailed account of the instrumentation and principles of SEM, broadly explaining its capabilities in resolution and depth of field imaging. It describes three additional functions of SEM, including the use of channeling patterns to evaluate the crystallographic orientation of micron-sized regions; use of backscattered detectors to reveal grain boundaries on unetched samples and domain boundaries in ferromagnetic alloys; and the use of voltage contrast, electron beam-induced currents, and cathodoluminescence for the characterization and failure analysis of semiconductor devices. The article compares the features of SEM with that of scanning Auger microscopes, and lists the applications and limitations of SEM.