X-ray computed tomography is a noninvasive technique that can reveal the internal structure of objects in three dimensions with spatial resolution down to 50 nm. This article discusses the basic principles of this increasingly important imaging technology and presents examples of its use on various types of defects in semiconductor packages.

3D imaging, IC package defects, nondestructive technique, X-ray computed tomography
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2010
ASM International
Topics
Electronic packaging X-ray microtomography Semiconductor wafer fabrication
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