Recent Advances in Acoustic Microimaging of Thin-Silicon Devices

Acoustic microimaging has advanced over the past few years in response to the growing use of thinner silicon die and innovative packaging designs. This article reviews the basic principles of acoustic imaging technology and describes some of the applications made possible by improvements in spatial resolution, focal length, F-number, and water couplant temperature control. It also discusses common imaging challenges and explains how they can be resolved.