The pace of development for 2.5-D packaging solutions appears to be accelerating as the timeline for the adoption of 3D through-silicon via (TSV) technology continues to slide. This column discusses the latest advancements in 2.5-D or interposer packaging technology and the growing number of applications.

2.5-D TSV packages, stacked-die packaging, TSV interposers
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Copyright © ASM International® 2012
2012
ASM International
Topics
Electronic packaging Semiconductor wafer fabrication
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