Abstract
One of the co-chairs of the Case Histories sessions at ISTFA 2012 provides a summary of three papers that demonstrate a solid understanding of the semiconductor FA process. The first paper describes the investigation of fractures in PCB traces, the second paper presents a method for analyzing defects due to implanter charging effects, and the third paper explains how analysts determined the cause of automatic test pattern generation failures concentrated in certain areas of the wafer.
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2013
ASM International
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