The inverted orientation of a flip-chip packaged die makes it vulnerable to optical attacks from the backside. This article discusses the nature of that vulnerability, assesses the threats posed by optical inspection tools and techniques, and provides insights on effective countermeasures.

electro-optical probing, flip-chip packages, hardware security, laser fault injection, optical attack, threat models
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ASM International
Topics
Electronic packaging Specimen preparation Semiconductor wafer fabrication Quality assurance and testing
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