This article addresses the considerations related to the development and introduction of new materials in response to the increasing performance demands of microelectronic devices, and how these new materials will affect characterization and failure analysis. The article is largely extracted from the “Deprocessing/Inspection White Paper” generated by the SEMATECH Product Analysis Forum (PAF), with updates from the PAF response to the International Technology Roadmap for Semiconductors.

failure analysis, microelectronic devices, roadmap, SEMATECH Product Analysis Forum
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Copyright © ASM International® 2001
2001
ASM International
Topics
Semiconductor wafer fabrication
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