Abstract
Electronic device failure analysis usually starts with electrical testing, followed by visual inspection via optical microscopy, then examination in a scanning electron microscope. When imaging reveals the need to determine the composition of materials, defects, and suspected contaminants, the electron beam produced by the SEM can be used to obtain the necessary information. As the article explains, this is the basic concept behind the method known as energy dispersive X-ray spectroscopy (EDS or EDX) and the key to its widespread use. In addition, the article presents three examples showing how SEM/EDS measurements helped failure analysts identify human contaminants on a die sample, determine the source of a particle embedded in the film stack on a wafer, and conclude that lead spatter from a solder die-attach preform caused wire bond lift.
