Polishing Samples for TEM Analysis Using the Tripod Polishing Technique

This article describes a sample preparation technique by which specific areas on integrated circuits can be manually polished to TEM transparency. The technique, called tripod polishing or the wedge method, produces cross-section samples within a few hours that require little or no additional thinning for TEM analysis. The method can also be used to prepare plan view TEM samples as well as samples for SEM analysis and light microscopy.