This article describes how focused ion beam (FIB) technology is being used in combination with various other analytical tools for failure and yield analysis of MEMS devices. It provides examples showing how FIB is used with TEM analysis, AFM analysis, scanning acoustic microscopy, and scanning laser microscopy.

acoustic microscopy, atomic force microscopy, FIB techniques, laser microscopy, TEM analysis
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2000
ASM International
Topics
Acoustic microscopy Transmission electron microscopy Atomic force microscopy Semiconductor wafer fabrication
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