Although plastic-encapsulated packaging dominates most of the IC industry, deprocessing and reliability testing continue to be a problem, particularly in industries making the switch from hermetically sealed ceramic packages. This article discusses the challenges designers and failure analysts face in the military and aerospace electronics industry stemming from the use of plastic packages. It provides examples of the types of failures encountered and describes the procedures used to detect and identify them.

decapsulation, plastic-encapsulated packages, qualification testing, scanning acoustic microscopy
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Copyright © ASM International® 2005
2005
ASM International
Topics
Electronic packaging Scanning acoustic microscopy Semiconductor wafer fabrication Qualification
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