With the July 2006 implementation of RoHS (the restriction of the use of certain hazardous substances in electrical and electronic equipment), the electronics reliability industry has seen a changeover to lead-free solders and “green” mold compounds that have no bromine- or antimony-based flame retardants. This article addresses some of the challenges caused by implementation of the new requirements.

hazardous substances, laboratory practices
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Copyright © ASM International® 2006
2006
ASM International
Topics
Semiconductor wafer fabrication
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