Shortcuts in failure analysis are sometimes to save time or money or because equipment or expertise is unavailable. This article presents simple but effective solutions in four areas, including deprocessing, FIB milling, microcleaving, and TEM sample preparation, that may help analysts work through or around such situations.

deprocessing, FIB milling, microcleaving, TEM sample preparation
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Copyright © ASM International® 2011
2011
ASM International
Topics
Specimen preparation Transmission electron microscopy Semiconductor wafer fabrication
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