A Review of the ISTFA 2012 Panel Discussion: Failure Analysis Challenges of 3Di Packaging

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Technical article| February 01 2013

Dave Vallett

IBM Systems and Technology Group

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EDFA Technical Articles (2013) 15 (1): 34.

https://doi.org/10.31399/asm.edfa.2013-1.p034

Abstract

This article provides a summary of the ISTFA 2012 Panel Discussion on the FA challenges associated with 3D integrated packages.

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2013

ASM International

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