This article discusses the primary differences between electrostatic discharge (ESD) and electrical overstress (EOS) and the circumstances under which they occur. It also explains how to differentiate ESD from EOS during failure analysis and how to avoid common misunderstandings and mistakes.

electrical overstress, electrostatic discharge, EOS, ESD, root cause analysis
This content is only available as a PDF.
Copyright © ASM International® 2013
2013
ASM International
Topics
Semiconductor wafer fabrication Root cause analysis
You do not currently have access to this content.