This article describes two accelerated reliability tests that can help shorten product development cycles for power semiconductor packages. One test simulates the effects of temperature cycling by applying a series of thermal shocks to the test sample. The other test assesses the bond between metals and molding compounds as a measure of thermal cycle resistance. A button shear test is used to measure changes in adhesion strength as a function of time and temperature.

accelerated reliability testing, button shear testing, molding compound, power semiconductor packages, thermal shock testing
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Copyright © ASM International® 2013
2013
ASM International
Topics
Electronic packaging Semiconductor wafer fabrication Reliability testing
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