Magnetic current imaging provides electrical fault isolation for shorts, leakage currents, resistive opens, and complete opens. In addition, it can be performed nondestructively from either side a die, wafer, packaged IC, or PCB. This article reviews the basic theory and attributes of MCI, describes the types of sensors used, and discusses general measurement procedures. It also presents application examples demonstrating recent advancements and improvements in MCI.

fault isolation, GMR sensors, magnetic current imaging, SQUID sensors
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Copyright © ASM International® 2014
2014
ASM International
Topics
Scanning probe microscopy Semiconductor wafer fabrication
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