This article assesses the progress that has been made in the development and implementation of through-silicon via (TSV) technology, the work yet to be done, and the challenges associated with potential failure mechanisms.

3D ICs, through-silicon vias, via failures
This content is only available as a PDF.
Copyright © ASM International® 2014
2014
ASM International
Topics
Electronic packaging Semiconductor wafer fabrication Reliability testing
You do not currently have access to this content.