A detailed analysis based on FIB etching and SEM image capture was conducted on a flip-chip solder joint deep inside a tablet PC. 3D views reconstructed from SEM images show what appears to be a copper pillar with a solder cap connected to a copper trace on the substrate. The investigators believe the joint was formed by thermal compression bonding with a preapplied underfill. The analysis also revealed the presence of voids and intermetallic compounds along with signs of filler entrapment.

copper pillar bumps, FIB-SEM slice and view, flip-chip interconnect, solder joints
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Copyright © ASM International® 2016
2016
ASM International
Topics
Electronic packaging Scanning electron microscopy Focused ion beam tomography Semiconductor etching
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