Abstract
Failure analysis has become a critical enabler of semiconductor technology innovations. Logic and memory scaling continues at an unabated pace with new materials and transistor architectures being introduced. The integration of advanced packaging technologies like chiplets, 2.5D, and 3D in mainstream devices is exploding. To address these challenges, a new industry-wide FA Technology Roadmap was created and approved by the EDFAS Board in 2020. This column discusses the planned next steps in the Roadmap project.
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