A noninvasive thermal imaging approach based on the thermoreflectance principle is proposed for analyzing advanced semiconductor devices. Several examples illustrate the value of this approach in detecting thermal anomalies and defects missed by other techniques.

reflectivity, submicron defect detection, thermal imaging, thermoreflectance based imaging, TTI
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2019
ASM International
Topics
Semiconductor wafer fabrication Reflectivity Thermography Resolution Test method evaluation
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