This article presents a method for determining the integrity of solder joints made from mixed and lead-free solders. It discusses the procedures involved in sample preparation and testing and explains how to interpret the results, particularly the effect intermetallic formation, cracking, and voiding.

joint integrity, lead-free soldering, mechanical shock testing, shear testing, solder joints, temperature cycling
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Copyright © ASM International® 2006
2006
ASM International
Topics
Solders and solder alloys Shear testing Specimen preparation Semiconductor wafer fabrication
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