Recent improvements in giant magnetoresistance sensors have increased the achievable spatial resolution of magnetic current imaging on packaged devices without a significant compromise in magnetic field sensitivity. Front and backside current imaging examples show the utility of these new sensors for die-level failure analysis.

giant magnetoresistance, GMR sensors, magnetic current imaging, sensitivity
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Copyright © ASM International® 2006
2006
ASM International
Topics
Sensors Scanning probe microscopy Semiconductor wafer fabrication
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