The ISTFA 2006 panel discussion focused on the integration of test and failure analysis, a topic that was originally addressed at ISTFA 2000. The goal of this year’s panel was to discuss the improvements made to the integration of test and failure analysis and to explore our capabilities for analyzing future technologies.

ISTFA panel
This content is only available as a PDF.
Copyright © ASM International® 2007
2007
ASM International
Topics
Semiconductor wafer fabrication
You do not currently have access to this content.